E
QUIPMENT
Fully-Automatic Laser Cutting and
Sorting System for FPC
(250mm*100mm)*2
Fully-Automatic Laser Cutting and
Sorting System for FPC
(250mm*100mm)*2
(250mm*100mm)*2
Size of working area
1.2 s/pcs
Processing speed
zigzag <30μm
Edge chipping
±50μm
Cutting size precision
Specifications
Size of working area:(250mm*100mm)*2
Applicable materials: <0.8mm thick PCB, FPC, cover film,
FP4, composite materials; <0.3mm thick sapphire
Laser focal spot size: 20-30μm
Processing speed: 1.2 s/pcs
Cutting size precision: ±50μm
Edge chipping: zigzag <30μm
Sorting positional accuracy:±0.1μm
Applicable shapes:straight lines, oblique lines, and curves
Max. UPH>300
Features
◆Automatic dual-position laser processing
◆Automatically loading from workpiece tray stack
◆Automatic unloading of cut products onto tray
◆Unloading trays are automatically arranged in a stack
◆Automatically detects and skips cutting of defected material that has been marked
◆Cutting dimensional accuracy: ±30μm
◆Edge chipping: <20μm
◆Max. UPH: >3000