Specifications

Working area:250mm*200mm (per position)

Applicable materials: PCB/FPC/cover film/FR4/composite materials

Laser focal spot size: 20-30μm

Scanning speed: 5000mm/s (max)

Cutting time: 2.5s/pc

Dimensional accuracy: ±30μm

Edge chipping:<20μm

Positional accuracy:±3μm

Repeatability:±3μm

Features

◆Dual-laser, dual-position automatic processing

◆Automatically loading from workpiece tray stack

◆Automatic sorting of individual cut pieces onto an unloading tray

◆Automatic stacking of unloading trays

◆Automatic detection of defective material tags; tagged material is not cut

◆Dimensional accuracy: ±30μm

◆Edge chipping: <20μm

◆Cutting time: 2.5s/pc